■157SD keeps the anti-adhesion layer intact, even under solvent attack, and allows you to easily peel off the mask, even against a liquid resist with strong tacking capability.

Some halogen-free liquid photo resists or those for packaging substrates contain special solvent.

This solvent removes the anti-adhesion layer from the photo mask protection film and, resultantly, earlier tape replacement is unavoidable.

The TACKWELL 157SD withstands such solvent attack to retain the anti-adhesion layer and extensively improve the durability of the tape. This minimizes the replacement of protection film while the liquid resist is being used. In addition, 157SD is superior in optical performance and provides the best solution for high-density packaging substrates such as BGA.