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| Low Outgas Release Film |
| DATE：2018-12-09【BIG MID SMALL】 TOP： Copyright By SEKISUI Chemical |
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Low Outgas Release Film
Features
- Clean film featuring thermal stability of its component polymer and little emission of outgassing component.
- High mechanical strength including tensile force,breaking elongation,and tear strength and low directional property.
- Low rate change in dimensions at high temperatures,excellent dimensional stability.
Characteristics
General physical properties
| Item |
Measured value |
Test method |
| Outgas amount(ppm) |
250 |
Amount of volatille components emitted when heated at 170'C fot 10minutes(based on toluene convension) |
| Tensile strength[23'C](MPa) |
MD |
51 |
JIS K7127 |
| TD |
53 |
| Tensile elongation[23'C](%) |
MD |
700 |
JIS K7127 |
| TD |
720 |
| Tear strength[23'C](KN/m) |
MD |
170 |
JIS K7128-3 |
| TD |
170 |
| Dimension rate of change[170'C](%) |
MD |
-0.9 |
Heating time:30minutes Dimension rate of change=(dimension after heating-dimension before heating)/(dimension before heating) |
| TD |
-0.3 |
| Melting point('C) |
223 |
JIS K7121 |
| Blocking force('C) |
1.6 |
ASTM D1893 |
| Density(g/cm3) |
1.31 |
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*The above figures are only measurements,their values are not guaranteed.
Applications
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- Release film for printed-circuit board heat-press processes.
- Release film for liquid-crystal glass laminating press processes.
- ■Low outgassing test
Example of use
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