This is a tape used in manufacturing component-embeded substrates,which can temporarily fix components at temperatures of up to 150 ℃ and be removed by UV irradiation.
Application
■Fixing of chips in a component-embedded substrate.
Characteristics
General physical properties
Item
Unit
Thickness
base film
50μm
adhesive
40μm
Item
Unit
23℃
150℃ for 20 min.
Adhesion*
Before UV irrradiation
N/25mm
4.0
17.0
After UV irradiation
0.05
0.30
*Adhesion: 180°peel testing at a speed of 300mm/min. UV irradiation 1000mJ *The above figures are only measurements, their values are not guaranteed.
