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| Self-releasable Protective Tape in UBM Process SELFA-MP |
| DATE：2018-12-09【BIG MID SMALL】 TOP： Copyright By SEKISUI Chemical |
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Self-releasable Protective Tape in UBM Process SELFA-MP
This is a tape for protection for the back of wafers in the UBM process. This tape generates gas by UV irradiation, which makes it possible for the tape to be easily removed from an adherend.
Feature
- SELFA-MP has a UV self-releasing function that its adhesive strength goes down by UV irradiation, which enables the tape to be easily peeled off even after the plating process.
Application
■Protection for the back of a wafer in the UBM process.
Application examples
- UBM process
- Pre-treatment (Alkali solutions at with a ph of 9)
- Post-treatment (Strong acids and strong alkali)
- Metal plating (Ni,Au and other metal)
Characteristics
General physical properties
| Item |
Unit |
| Thickness |
base film |
25μm |
| adhesive |
30μm |
| Item |
Unit |
SUS |
Silicon wafer |
Gold plating |
| Adhesion |
Before UV irradiation |
N/25mm |
15.5 |
14.1 |
10.5 |
| After UV irradiation |
0 |
0 |
0 |
*Adhesion: 180°peel testing at a speed of 300mm/min. UV irradiation 3000mJ/cm²
*The above figures are only measurements, their values are not guaranteed.
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